Web hosting domain registrar, GoDaddy.com, recently participated in the St. Petersburg, Florida Honda Grand Prix, for the third season in a row, sponsoring Danica Patrick.
Ms. Patrick is the IndyCar Series' most popular driver. She was recently featured in Sports Illustrated’s famous Swimsuit Edition for the second consecutive year. She also made history last year as the first woman to win an IndyCar Series race after taking the checkered flag in Motegi, Japan.
During the off season, Ms. Patrick has certainly been busy. Earlier this year, she also starred in both Go Daddy Super Bowl ads. One of those GoDaddy-esque ads featured Ms. Patrick in the shower with another woman. The second ad, in which Ms. Patrick admitted to “enhancing” her Web site in a spoof of baseball’s steroid hearings, became the Most Watched Super Bowl commercial this year, according to TiVo.
Bob Parsons, CEO and Founder of Go Daddy offered, ''Danica has phenomenal star power. She has it all. She’s focused, determined, competitive and driven. She's a winner. She's smokin' hot. She's a role model. I can’t think of another spokesperson who brings more to the table than Danica.''
One of Ms. Patrick's upcoming Go Daddy ads is bound to raise eyebrows for its edginess. In this one, a highway patrol officer pulls Ms. Patrick over for speeding. What unfolds thereafter may be Go Daddy's edgiest ad ever. The commercial is expected to debut during the Indianapolis 500 broadcast and features a cliffhanger, pushing viewers to the GoDaddy.com Web site for the ''too hot for television'' conclusion.
In a year when the economy is challenging for many sports sponsors, Go Daddy remains a staple for Ms. Patrick, who is scheduled to drive in all 17 races this season. The first race of the season was seen on the VERSUS television network this past Sunday.
Go Daddy will also be the Presenting Sponsor of the 93rd running of the legendary Indianapolis 500 set to take place May 24, which is the Sunday of Memorial Day weekend.
Go Daddy is in expansion mode with its hiring and its sponsorships, including deals with NASCAR’s Dale Earnhardt, Jr. and Brad Keselowski. Keselowski will attempt to qualify in the No. 25 GoDaddy.com Chevrolets for the Sprint Cup Series race at Texas Motor Speedway this weekend. If he does, he’ll be driving in that race the same day Ms. Patrick races in Florida.
Beyond racing, Go Daddy recently added two new Go Daddy Girls. Just last week, professional golfer and model Anna Rawson joined the ranks of spokeswomen. Also in March, Vanessa Rousso,
HTeam PokerStars Pro became a Go Daddy Girl. Just a few days later, she made history as the first woman to ever reach the final round in the National Heads-Up Poker Championship in Las Vegas.
Go Daddy is a world leader in domain registration, web hosting and new SSL certificates. Go Daddy makes getting online easy and affordable by offering products like WebSite Tonight, Go Daddy Marketplace and Quick Shopping Cart, recently rated the most popular shopping cart in a survey by Practical eCommerce. Go Daddy also provides industry-best, 24/7 personalized customer service.
Web hosting domain registrar, GoDaddy.com, recently participated in the St. Petersburg, Florida Honda Grand Prix, for the third season in a row, sponsoring Danica Patrick.
Ms. Patrick is the IndyCar Series' most popular driver. She was recently featured in Sports Illustrated’s famous Swimsuit Edition for the second consecutive year. She also made history last year as the first woman to win an IndyCar Series race after taking the checkered flag in Motegi, Japan.
During the off season, Ms. Patrick has certainly been busy. Earlier this year, she also starred in both Go Daddy Super Bowl ads. One of those GoDaddy-esque ads featured Ms. Patrick in the shower with another woman. The second ad, in which Ms. Patrick admitted to “enhancing” her Web site in a spoof of baseball’s steroid hearings, became the Most Watched Super Bowl commercial this year, according to TiVo.
Bob Parsons, CEO and Founder of Go Daddy offered, ''Danica has phenomenal star power. She has it all. She’s focused, determined, competitive and driven. She's a winner. She's smokin' hot. She's a role model. I can’t think of another spokesperson who brings more to the table than Danica.''
One of Ms. Patrick's upcoming Go Daddy ads is bound to raise eyebrows for its edginess. In this one, a highway patrol officer pulls Ms. Patrick over for speeding. What unfolds thereafter may be Go Daddy's edgiest ad ever. The commercial is expected to debut during the Indianapolis 500 broadcast and features a cliffhanger, pushing viewers to the GoDaddy.com Web site for the ''too hot for television'' conclusion.
In a year when the economy is challenging for many sports sponsors, Go Daddy remains a staple for Ms. Patrick, who is scheduled to drive in all 17 races this season. The first race of the season was seen on the VERSUS television network this past Sunday.
Go Daddy will also be the Presenting Sponsor of the 93rd running of the legendary Indianapolis 500 set to take place May 24, which is the Sunday of Memorial Day weekend.
Go Daddy is in expansion mode with its hiring and its sponsorships, including deals with NASCAR’s Dale Earnhardt, Jr. and Brad Keselowski. Keselowski will attempt to qualify in the No. 25 GoDaddy.com Chevrolets for the Sprint Cup Series race at Texas Motor Speedway this weekend. If he does, he’ll be driving in that race the same day Ms. Patrick races in Florida.
Beyond racing, Go Daddy recently added two new Go Daddy Girls. Just last week, professional golfer and model Anna Rawson joined the ranks of spokeswomen. Also in March, Vanessa Rousso, Team PokerStars Pro became a Go Daddy Girl. Just a few days later, she made history as the first woman to ever reach the final round in the National Heads-Up Poker Championship in Las Vegas.
Go Daddy is a world leader in domain registration, web hosting and new SSL certificates. Go Daddy makes getting online easy and affordable by offering products like WebSite Tonight, Go Daddy Marketplace and Quick Shopping Cart, recently rated the most popular shopping cart in a survey by Practical eCommerce. Go Daddy also provides industry-best, 24/7 personalized customer service.
Sunday, June 1, 2008
Middle East on Path to Digital Future Says Intel Chairman
WASHINGTON, D.C., May 8, 2008 – Speaking at the U.S.-Arab Economic Forum in Washington, D.C., Intel Corporation Chairman Craig Barrett shared his vision on the role of technology and education in driving a digital transformation in the Middle East.
"Education and technology can expand what is possible and create opportunities for people across the Middle East," said Barrett. The foundation for innovation in today's knowledge based economy relies on a highly educated workforce and a strong technology infrastructure. Together they make up the backbone of the modern economy."
Barrett also said such a region-wide agenda requires the combined efforts of the public and private sectors.
Barrett today announced several initiatives to build on Intel's comprehensive economic, educational and technology-related support throughout the region and the work of the Intel World Ahead program:
* Training 1,000 engineers on multi-core computer development at regional labs.
* Hosting internships and researchers visiting from the Middle East at Intel Research Labs globally.
* Developing Wireless Competency Centers in the region to assist local telecom operators successfully accelerate WiMAX deployments.
Barrett also announced Intel's commitment to the U.S.-Palestine Partnership with focus on training teachers, unwiring the West Bank and initiatives to encourage entrepreneurship.
These programs plus additional regional activities, which are to be unveiled at the World Economic Forum Middle East later in the month, continue to demonstrate Intel's commitment to the region.
Intel currently works with several local governments, educational institutions, businesses, NGOs and non-profit organizations, and local businesses to expand the use and understanding of technology and to develop suitable environments for innovation and research. Over the past decade, Intel has expanded its operations in the Middle East to include offices in Cairo, Riyadh, Beirut, Dubai and Casablanca.
"Education and technology can expand what is possible and create opportunities for people across the Middle East," said Barrett. The foundation for innovation in today's knowledge based economy relies on a highly educated workforce and a strong technology infrastructure. Together they make up the backbone of the modern economy."
Barrett also said such a region-wide agenda requires the combined efforts of the public and private sectors.
Barrett today announced several initiatives to build on Intel's comprehensive economic, educational and technology-related support throughout the region and the work of the Intel World Ahead program:
* Training 1,000 engineers on multi-core computer development at regional labs.
* Hosting internships and researchers visiting from the Middle East at Intel Research Labs globally.
* Developing Wireless Competency Centers in the region to assist local telecom operators successfully accelerate WiMAX deployments.
Barrett also announced Intel's commitment to the U.S.-Palestine Partnership with focus on training teachers, unwiring the West Bank and initiatives to encourage entrepreneurship.
These programs plus additional regional activities, which are to be unveiled at the World Economic Forum Middle East later in the month, continue to demonstrate Intel's commitment to the region.
Intel currently works with several local governments, educational institutions, businesses, NGOs and non-profit organizations, and local businesses to expand the use and understanding of technology and to develop suitable environments for innovation and research. Over the past decade, Intel has expanded its operations in the Middle East to include offices in Cairo, Riyadh, Beirut, Dubai and Casablanca.
Intel Updates vPro Platform Technologies
This past week, we attended an event where Intel gave us specific detail on the new hardware and features that are part of their vPro platform technology for 2007. If you’re unfamiliar with vPro, it’s not a singular product or chip. Like Centrino for example, vPro is an Intel platform technology that’s comprised of a CPU, chipset, network controller, and proprietary software, that when combined, offer powerful hardware-based security and management capabilities for the enterprise.
Intel Core 2 Duo Processors, Q35 Express, and 82566DM GigE network controller.
vPro itself is not new, but today Intel will be announcing fresh, new vPro certified hardware and will also announce a few new features enabled by them. Intel’s goals with this refresh were to increase security, manageability, and performance, while lowering power consumption requirements. In this effort, the company has certified the Core 2 Duo E6550, E6750 and E6850 processors for vPro, and are releasing the new low-power Q35 Express chipset with a companion ICH9-DO Southbridge, and 82566DM Gigabit Network controller.
With these new chispets and technologies, the vPro platform offers next-generation Intel Active Management Technology, enhanced Intel Virtualization Technology, and Intel Trusted Execution Technology (aka Intel TXT). vPro also offers support for next-generation management standards like WS-MAN and DASH (draft 1.0 spec) and support for v1.2 of the Trusted Platform Module.
vPro has always given users the ability to remotely manage PCs, but with this refresh Intel has further secured the platform and alleviated some previous security concerns. Unlike older hardware-based management tools that have no encryption or weak authentication, like Wake-on-LAN for example, vPro offers a Protected Management Channel with 128-bit TLS encryption and strong authentication to prevent unwanted snooping with its protected remote-wake mechanism.
Other security measures include a hardware-based “chain of trust” that gives IT managers the ability to launch a Virtual Machine Manger (VMM) into a known, expected state. And any changes made to the VMM can be detected via hash-based measurements. Trusted execution policies are managed in the system by the IT professional and specifically, the Q35 chipset has dedicated micro-engines internally to allow processing secure instructions and transactions on the host CPU. Intel Trusted Execution Technology-enabled hardware also removes residual data when the virtual machine is shut down to further protect data from memory snooping software. With this refresh, vPro also offers new Enhanced System Defense filters that screen each outbound packet and logs information about it. The logs can then be analyzed for malicious patterns of activity over time.
We saw some live demonstrations of some vPro enabled systems from Dell, Lenovo, and HP that showed the usefulness of the technology. In our meeting with Dell, an unbootable PC was logged into remotely and the OS was repaired by comparing it to a master disk image. This was possible because the network security credentials are stored in hardware, so even if the machine’s operating system is severely damaged, a technician can still connect to and work on the PC.
Like Centrino, Intel has plans to continually update the vPro platform over time to incorporate new features and technologies. We don’t have details on what will be available with next year’s refresh, but you can be sure Intel will further enhance vPro after the launch of their “Montevina” platform in the first half on 2008.
Intel Core 2 Duo Processors, Q35 Express, and 82566DM GigE network controller.
vPro itself is not new, but today Intel will be announcing fresh, new vPro certified hardware and will also announce a few new features enabled by them. Intel’s goals with this refresh were to increase security, manageability, and performance, while lowering power consumption requirements. In this effort, the company has certified the Core 2 Duo E6550, E6750 and E6850 processors for vPro, and are releasing the new low-power Q35 Express chipset with a companion ICH9-DO Southbridge, and 82566DM Gigabit Network controller.
With these new chispets and technologies, the vPro platform offers next-generation Intel Active Management Technology, enhanced Intel Virtualization Technology, and Intel Trusted Execution Technology (aka Intel TXT). vPro also offers support for next-generation management standards like WS-MAN and DASH (draft 1.0 spec) and support for v1.2 of the Trusted Platform Module.
vPro has always given users the ability to remotely manage PCs, but with this refresh Intel has further secured the platform and alleviated some previous security concerns. Unlike older hardware-based management tools that have no encryption or weak authentication, like Wake-on-LAN for example, vPro offers a Protected Management Channel with 128-bit TLS encryption and strong authentication to prevent unwanted snooping with its protected remote-wake mechanism.
Other security measures include a hardware-based “chain of trust” that gives IT managers the ability to launch a Virtual Machine Manger (VMM) into a known, expected state. And any changes made to the VMM can be detected via hash-based measurements. Trusted execution policies are managed in the system by the IT professional and specifically, the Q35 chipset has dedicated micro-engines internally to allow processing secure instructions and transactions on the host CPU. Intel Trusted Execution Technology-enabled hardware also removes residual data when the virtual machine is shut down to further protect data from memory snooping software. With this refresh, vPro also offers new Enhanced System Defense filters that screen each outbound packet and logs information about it. The logs can then be analyzed for malicious patterns of activity over time.
We saw some live demonstrations of some vPro enabled systems from Dell, Lenovo, and HP that showed the usefulness of the technology. In our meeting with Dell, an unbootable PC was logged into remotely and the OS was repaired by comparing it to a master disk image. This was possible because the network security credentials are stored in hardware, so even if the machine’s operating system is severely damaged, a technician can still connect to and work on the PC.
Like Centrino, Intel has plans to continually update the vPro platform over time to incorporate new features and technologies. We don’t have details on what will be available with next year’s refresh, but you can be sure Intel will further enhance vPro after the launch of their “Montevina” platform in the first half on 2008.
Intel unveils new chip technology
Intel has launched a new generation of chips that it hopes will boost its lead over rival Advanced Micro Devices heading into 2008.
The line of chips, code-named Penryn, uses a new manufacturing method that allows Intel (INTC) to make the chips both smaller and more efficient. Penryn chips should help companies like Hewlett-Packard (HPQ), Dell (DELL) and Apple (AAPL) to design more energy-efficient servers, more powerful of desktops and more portable laptops.
In the near term, Penryn’s value to Intel could be more about reputation than the bottom line. Earlier in the decade, competitor AMD (AMD) took advantage of the chip giant’s missteps and offered products that many in the industry judged to be technologically superior to Intel’s. But now Intel is back with a vengeance, and has AMD on the ropes. And because the Penryn chips are based on an advanced 45-nanometer manufacturing process, they give the company valuable bragging rights
The line of chips, code-named Penryn, uses a new manufacturing method that allows Intel (INTC) to make the chips both smaller and more efficient. Penryn chips should help companies like Hewlett-Packard (HPQ), Dell (DELL) and Apple (AAPL) to design more energy-efficient servers, more powerful of desktops and more portable laptops.
In the near term, Penryn’s value to Intel could be more about reputation than the bottom line. Earlier in the decade, competitor AMD (AMD) took advantage of the chip giant’s missteps and offered products that many in the industry judged to be technologically superior to Intel’s. But now Intel is back with a vengeance, and has AMD on the ropes. And because the Penryn chips are based on an advanced 45-nanometer manufacturing process, they give the company valuable bragging rights
Intel reveals new technologies - EUV technology
In the middle of the African desert, among the Moroccan dunes of Mezouga, Intel decided to present to the French press the strategies for the near future regarding the development and marketing of the processors. After launching at the beginning of this week the dual-core processors and after long debates about Moore’s law which is still standing even after 40 years, the company began to talk about a new perspective on the technologies regarding the manufacturing process.
After a brief mentioning of the first silicon processor, Intel emphasized its advantages on the production of advanced processing solutions. Having 5 factories spread all over the world and the possibility to manufacture wafers of 300 mm, Intel wants to push the manufacturing process to a whole new level: the company targets the implementation of the High-K technology and migrating until 2007 to the 45 nanometer graving solution. The secret to this is a grid isolator whose role is to prevent the electron leakage. In the same time, Intel will start using metallic electrodes, and starting with 2007 and until 2009, the producer estimated it will change the structure of the transistors by introducing the Tri-Gate solutions. Using an original non-planar arrangement of transistors, Intel hopes to optimize their properties. This optimization consists in the simplification and acceleration of electrons, avoiding in the same time the specific problems of electron leakage.
Normally, the electrons flow in a horizontal plan, but using these solutions will make them flow both on vertical and on horizontal direction. The cells of the Tri-Gate processors will communicate through nanomolecular connections, and once the nanotube type transistors appear, the diameter of each transistor will decrease under the 2 nanometer limit.
Intel is also planning the progressive transition to the EUV technology, or Extreme Ultraviolet Lithography, a solution that allows the graving of the processors at 32 nanometers and which will be available by 2009.
After a brief mentioning of the first silicon processor, Intel emphasized its advantages on the production of advanced processing solutions. Having 5 factories spread all over the world and the possibility to manufacture wafers of 300 mm, Intel wants to push the manufacturing process to a whole new level: the company targets the implementation of the High-K technology and migrating until 2007 to the 45 nanometer graving solution. The secret to this is a grid isolator whose role is to prevent the electron leakage. In the same time, Intel will start using metallic electrodes, and starting with 2007 and until 2009, the producer estimated it will change the structure of the transistors by introducing the Tri-Gate solutions. Using an original non-planar arrangement of transistors, Intel hopes to optimize their properties. This optimization consists in the simplification and acceleration of electrons, avoiding in the same time the specific problems of electron leakage.
Normally, the electrons flow in a horizontal plan, but using these solutions will make them flow both on vertical and on horizontal direction. The cells of the Tri-Gate processors will communicate through nanomolecular connections, and once the nanotube type transistors appear, the diameter of each transistor will decrease under the 2 nanometer limit.
Intel is also planning the progressive transition to the EUV technology, or Extreme Ultraviolet Lithography, a solution that allows the graving of the processors at 32 nanometers and which will be available by 2009.
C e N t R i N o
Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer. Intel claimed that systems equipped with these technologies should deliver better performance, longer battery life and broad wireless network interoperability.
To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts, otherwise using only the processor and chipset will carry the Intel Core label instead.
Carmel platform (2003)
Intel used Carmel as the code name for the first-generation Centrino platform introduced in March 2003.
The Carmel platform consists of:
an Intel Pentium M processor (code-named Banias or later Dothan) with a 400 MT/s FSB, Socket 478 and
an Intel 855 series chipset (code-named Odem or Montara with Intel Extreme Graphics 2), DDR-266 and
an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI Wi-Fi adapter (code-named Calexico or Calexico2).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code-named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems
Sonoma platform (2005)
Intel used Sonoma as the code name for the second-generation Centrino platform, introduced in January 2005.
The Sonoma platform consists of:
an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB, Socket 479 and
an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), DDR2-533 and
the Intel PRO/Wireless 2200 or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.6 hours of battery-life on a 53 W-h battery.Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer. Intel claimed that systems equipped with these technologies should deliver better performance, longer battery life and broad wireless network interoperability.
To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts, otherwise using only the processor and chipset will carry the Intel Core label instead.
Carmel platform (2003)
Intel used Carmel as the code name for the first-generation Centrino platform introduced in March 2003.
The Carmel platform consists of:
an Intel Pentium M processor (code-named Banias or later Dothan) with a 400 MT/s FSB, Socket 478 and
an Intel 855 series chipset (code-named Odem or Montara with Intel Extreme Graphics 2), DDR-266 and
an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI Wi-Fi adapter (code-named Calexico or Calexico2).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code-named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems
Sonoma platform (2005)
Intel used Sonoma as the code name for the second-generation Centrino platform, introduced in January 2005.
The Sonoma platform consists of:
an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB, Socket 479 and
an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), DDR2-533 and
the Intel PRO/Wireless 2200 or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.6 hours of battery-life on a 53 W-h battery.
To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts, otherwise using only the processor and chipset will carry the Intel Core label instead.
Carmel platform (2003)
Intel used Carmel as the code name for the first-generation Centrino platform introduced in March 2003.
The Carmel platform consists of:
an Intel Pentium M processor (code-named Banias or later Dothan) with a 400 MT/s FSB, Socket 478 and
an Intel 855 series chipset (code-named Odem or Montara with Intel Extreme Graphics 2), DDR-266 and
an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI Wi-Fi adapter (code-named Calexico or Calexico2).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code-named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems
Sonoma platform (2005)
Intel used Sonoma as the code name for the second-generation Centrino platform, introduced in January 2005.
The Sonoma platform consists of:
an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB, Socket 479 and
an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), DDR2-533 and
the Intel PRO/Wireless 2200 or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.6 hours of battery-life on a 53 W-h battery.Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer. Intel claimed that systems equipped with these technologies should deliver better performance, longer battery life and broad wireless network interoperability.
To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts, otherwise using only the processor and chipset will carry the Intel Core label instead.
Carmel platform (2003)
Intel used Carmel as the code name for the first-generation Centrino platform introduced in March 2003.
The Carmel platform consists of:
an Intel Pentium M processor (code-named Banias or later Dothan) with a 400 MT/s FSB, Socket 478 and
an Intel 855 series chipset (code-named Odem or Montara with Intel Extreme Graphics 2), DDR-266 and
an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI Wi-Fi adapter (code-named Calexico or Calexico2).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code-named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems
Sonoma platform (2005)
Intel used Sonoma as the code name for the second-generation Centrino platform, introduced in January 2005.
The Sonoma platform consists of:
an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB, Socket 479 and
an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), DDR2-533 and
the Intel PRO/Wireless 2200 or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.6 hours of battery-life on a 53 W-h battery.
AMD Virtualization™ (AMD-V™) With Rapid Virtualization Indexing
* Silicon feature-set enhancements designed to improve the performance, reliability, and security of existing and future virtualization environments by allowing virtualized applications with direct and rapid access to their allocated memory.
o BENEFIT : Helps virtualization software to run more securely and efficiently enabling a better experience when dealing with virtual systems
o BENEFIT : Helps virtualization software to run more securely and efficiently enabling a better experience when dealing with virtual systems
Key Architectural Features of AMD Phenom™ X4 Quad-Core Processors
The industry's first true Quad core x86 processor
* True quad-core designed from the ground up for better communication between cores.
o BENEFIT : Cores can communicate on die rather than on package for better performance
AMD64 with Direct Connect Architecture
* Helps improve system performance and efficiency by directly connecting the memory controller and I/O to the CPU.
* Designed to enable simultaneous 32- and 64-bit computing
* Integrated DDR2 Memory Controller
* BENEFITS :
o Increases application performance by reducing memory latency
o Scales memory bandwidth and performance to match compute needs
o HyperTransport™ Technology provides up to 16.0GB/s peak bandwidth per processor—reducing I/O bottlenecks
o Up to 33.1GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
AMD Balanced Smart Cache
* Shared L3 cache
* In addition to the 512K L2 cache per core, up to 2MB of L3 cache shared by up to 4 cores.
o BENEFIT : Shortened access times to highly accessed data for better performance.
AMD Wide Floating Point Accelerator
* 128-bit floating point unit (FPU)
* High performance (128bit internal data path) floating point unit per core.
o BENEFIT : Larger data paths for quicker floating point calculations and better performance.
HyperTransport™ technology
* One 16-bit link up to 4000MT/s
* Up to 8.0 GB/s HyperTransport™ I/O bandwidth; Up to 16.0GB/s in HyperTransport Generation 3.0 mode
* Up to 33.1GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
o BENEFIT : Quick access times to system resources for better performance.
Integrated DDR2 DRAM Controller with AMD Memory Optimizer Technology
* A high-bandwidth, low-latency integrated DDR2 memory controller
* Supports PC2-8500 (DDR2-1066); PC2-6400 (DDR2-800), PC2-5300 (DDR2-667), PC2-4200 (DDR2-533) or PC2-3200 (DDR2-400) SDRAM unbuffered DIMMs
* Support for 64-bit DDR2 SDRAM memory
* Up to 17.1GB/s memory bandwidth
o BENEFIT : Quick access to system memory for better performance.
* True quad-core designed from the ground up for better communication between cores.
o BENEFIT : Cores can communicate on die rather than on package for better performance
AMD64 with Direct Connect Architecture
* Helps improve system performance and efficiency by directly connecting the memory controller and I/O to the CPU.
* Designed to enable simultaneous 32- and 64-bit computing
* Integrated DDR2 Memory Controller
* BENEFITS :
o Increases application performance by reducing memory latency
o Scales memory bandwidth and performance to match compute needs
o HyperTransport™ Technology provides up to 16.0GB/s peak bandwidth per processor—reducing I/O bottlenecks
o Up to 33.1GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
AMD Balanced Smart Cache
* Shared L3 cache
* In addition to the 512K L2 cache per core, up to 2MB of L3 cache shared by up to 4 cores.
o BENEFIT : Shortened access times to highly accessed data for better performance.
AMD Wide Floating Point Accelerator
* 128-bit floating point unit (FPU)
* High performance (128bit internal data path) floating point unit per core.
o BENEFIT : Larger data paths for quicker floating point calculations and better performance.
HyperTransport™ technology
* One 16-bit link up to 4000MT/s
* Up to 8.0 GB/s HyperTransport™ I/O bandwidth; Up to 16.0GB/s in HyperTransport Generation 3.0 mode
* Up to 33.1GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
o BENEFIT : Quick access times to system resources for better performance.
Integrated DDR2 DRAM Controller with AMD Memory Optimizer Technology
* A high-bandwidth, low-latency integrated DDR2 memory controller
* Supports PC2-8500 (DDR2-1066); PC2-6400 (DDR2-800), PC2-5300 (DDR2-667), PC2-4200 (DDR2-533) or PC2-3200 (DDR2-400) SDRAM unbuffered DIMMs
* Support for 64-bit DDR2 SDRAM memory
* Up to 17.1GB/s memory bandwidth
o BENEFIT : Quick access to system memory for better performance.
Intel Delays Centrino 2 Launch Over Chipset, Antenna Issues
Intel will delay the launch of its upcoming Centrino 2 platform for laptop computers to resolve issues related to the chipset and the antenna used with the wireless chipset.
Centrino 2, also called Montevina, is the next version of Intel's popular Centrino platform for laptops and was previously slated for a June launch. Computer makers are now expected to begin shipping Centrino 2 systems to retail shops in July, with production reaching high volumes during the first week of August, said Elvin Ong, an Intel spokesman in
The Centrino 2 platform includes new Core 2 Duo and Core 2 Extreme
"We are taking the extra days to address two issues that require us to re-screen our chipsets with integrated graphics, and attend to some terms-and-conditions mistakes while filing and testing our wireless antennas," Ong said, adding that Intel expects Centrino 2 laptops to be available in time for the crucial back-to-school selling season.
Ong declined to detail the chipset issues that require Intel to re-screen these products, but said the move was necessary to insure the quality of the product. "We are not going to ship a sub-par product into the market," he said.
There is no problem with the processors used in Centrino 2, Ong said, calling these chips "healthy."
AMD accuses Intel in vendor payoff scheme
There's no love lost between rival chipmakers AMD and Intel, and this week's news isn't going to improve the relationship. According to legal filings and news reports, AMD alleges that Intel has paid major computer manufacturers not to use AMD products. The company filed a 108-page document with the court this week containing more details of the alleged scheme, but many of the points remain redacted. (According to Intel, AMD isn't alleging any new complaints in its latest filing, it's just making a few more of those complaints available to to the public.)
AMD and Intel have been fighting it out in court since 2005, when AMD first accused Intel of being a monopoly under anti-trust law. Intel has long been the market share leader in computer CPUs (actually, it's been the leader ever since PCs were invented), but AMD began to challenge that leadership in 2003-'04 as AMD innovated some then-unprecedented features into its chips, releasing the first 64-bit CPU and the first dual-core chips for consumer-level computers.
AMD's lawsuit alleges that rather than innovate a competitive response, Intel instead leveraged its vast power in the market to have AMD pushed to the sidelines by paying Dell, Gateway, Acer, HP, and others not to use AMD chips. (Of course, Intel did eventually mount a response: When the Core series of chips were released in 2006, Intel regained its place as the producer of the best chips on the market, a spot it's held ever since.)
Though I am not a lawyer, pay-for-placement schemes like this, if the allegations are true, are not immediately and universally illegal (after all, this is a big reason why Blu-ray ultimately beat HD DVD), but it will be up to the courts to decide whether legal lines were crossed. Intel has denied any wrongdoing, saying in its filing that any payments made simply amount to rebates and price cuts.
I'll also note that all of the companies mentioned, to my knowledge, have always offered products with AMD chips, even though they may not make up a large part of the product portfolio. That said, AMD accuses Intel of a whole range of wrongdoing, including predatory pricing and even tampering with benchmarks to make its products look better. Again, Intel denies all such claims in its response.
There clearly won't be a resolution to this issue until it is dealt with by the courts, and that seems some years off, unless a settlement is brokered. (The trial is already three years old: The current kerfuffle is over how many depositions each side can call for, so we're in for a long haul.)
Intel launching six-core CPUs this year
While most of us are still stuck with dual-core microchips (if that), Intel is prepping to launch a six-core processor in the second half of 2008. While the company currently offers a few four-core, or quad-core, models of its chips, most currently-sold machines still come with the more affordable dual-core CPUs installed.
The six-core chip is code-named Dunnington and will be built using the same 45nm process that Intel is using for its just-released Penryn-class chips. Another key feature is the chip's large level of level 3 (or L3) cache, 16MB, which is one of the memory buffers between the processor and RAM that are used to speed the overall performance of the chip. Most current Intel chips don't use any L3 cache, instead using only L2 cache: L3 has historically been limited to server-class computer chips, though AMD's Phenom chip has 2MB of L3 onboard. (Bottom line for those who don't understand any of this stuff: This chip ought to be blazing fast, at least on paper.)
The bigger question now becomes what Joe Average might actually do with six cores of processing power available to him. Numerous performance benchmarks have shown little real-world advantage in moving from two cores to four, even in high-end applications. Users who spend most of their time browsing the web and replying to email will find even less of a performance boost. That said, other computer components tend to get faster and more capable alongside new CPUs, so a Dunnington-based computer ought to feel very fast at booting, loading applications, and running complex processes like spell-checking a large document. Running an antivirus scan in the background which bogs down most computers should be no problem on a six-core CPU, too.
Expect Dunnington to arrive first for desktop PCs later this year. Intel hasn't said whether laptops are part of the plan for the technology, but given quad-core's limited introduction on notebook computers, I'd expect this to remain hard to find in a portable format for some time. More details as they emerge.
The six-core chip is code-named Dunnington and will be built using the same 45nm process that Intel is using for its just-released Penryn-class chips. Another key feature is the chip's large level of level 3 (or L3) cache, 16MB, which is one of the memory buffers between the processor and RAM that are used to speed the overall performance of the chip. Most current Intel chips don't use any L3 cache, instead using only L2 cache: L3 has historically been limited to server-class computer chips, though AMD's Phenom chip has 2MB of L3 onboard. (Bottom line for those who don't understand any of this stuff: This chip ought to be blazing fast, at least on paper.)
The bigger question now becomes what Joe Average might actually do with six cores of processing power available to him. Numerous performance benchmarks have shown little real-world advantage in moving from two cores to four, even in high-end applications. Users who spend most of their time browsing the web and replying to email will find even less of a performance boost. That said, other computer components tend to get faster and more capable alongside new CPUs, so a Dunnington-based computer ought to feel very fast at booting, loading applications, and running complex processes like spell-checking a large document. Running an antivirus scan in the background which bogs down most computers should be no problem on a six-core CPU, too.
Expect Dunnington to arrive first for desktop PCs later this year. Intel hasn't said whether laptops are part of the plan for the technology, but given quad-core's limited introduction on notebook computers, I'd expect this to remain hard to find in a portable format for some time. More details as they emerge.
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